| Place of Origin: | China |
|---|---|
| Brand Name: | JUKI |
| Certification: | CE |
| Model Number: | KE-3010 |
| Minimum Order Quantity: | 1 set |
| Price: | negotiable |
| Packaging Details: | Wooden box |
| Delivery Time: | 3-7 days |
| Payment Terms: | D/P, Western Union, T/T |
| Supply Ability: | 100 set/month |
| BRAND: | Juki | PAYMENT TERMS: | Pay In Advance |
|---|---|---|---|
| DELIVERY TIME: | 5-8 Days | The Machine Model: | JUKI Placement Machine KE-3010 |
| Price: | Negotiable | USED: | Good Condition |
| SHIPPING TERMS: | Air Or Sea | MOQ: | 1 Set |
| High Light: | High Speed JUKI SMT Machine,3mm JUKI SMT Machine,KE-3010 JUKI Pick And Place |
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JUKI KE - 3010 increase the speed of pallet supply components to improve production efficiency:
The high-speed placement machine "KE-3010" is an upgraded version of the "KE-2070". It is also the first model in the KE series that supports the use of electric feeders for chip placement machines. The high-speed general-purpose placement machine "KE-3020V/3020VR" is a successor model to the "KE-3020/3020R" model that can mount various components. While inheriting the advantages of the KE series, the mounting speed is greatly increased. The machine adopts "high-speed uninterrupted image recognition" technology, and its IC component placement speed is 63% higher than previous models. In addition, the machine adopts the newly developed high-speed pallet server, which can shorten the pallet replacement time, so it can greatly increase the speed of pallet supply components, so as to achieve the purpose of improving production efficiency.
■Corresponding to long size substrates (option)
Specifications of JUKI high-speed universal placement machine KE-3010:
| Substrate size | L-Wide type substrate (510×360mm)*1 | ○ | |
| L-shaped substrate (410mm×360mm) | ○ | ||
| L-Wide type substrate (510×360mm)*1 | ○ | ||
| XL type substrate (610mm×560mm) | ○ | ||
| Long substrate (L-shaped substrate specification) *2 | 800×360mm | ||
| Long board (L-Wide type board specification) *2 | 1,010×360mm | ||
| Long board (XL type board specification) *2 | 1,210×560mm | ||
| Component height | 12mm specification | ○ | |
| 20mm specification | ○ | ||
| 25mm specification | ○ | ||
| Component size | Laser recognition | 0402 (British 01005) chip～33.5mm square element | |
| Withdrawal recognition | Standard camera | 3mm～74mm square element, or 50×150mm | |
|
High resolution camera (All are optional) |
1.0mm×0.5mm*3～48mm square element, or 24×72mm | ||
| Component placement speed | Chip components | condition | 20,900CPH |
| IPC9850 | 17,100CPH | ||
| IC component*4 | 9,470CPH *5 | ||
| Component placement accuracy | Laser recognition | ±0.05mm(Cpk≧1) | |
| Image Identification | ±0.03mm(MNVC±0.04mm) | ||
| Component placement type | 160 types (converted to 8mm tape (when using an electric dual-track tape feeder)) *6 | ||
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