SIPLACE SX2 SMT Chip Mounter Machine Lower Resistance Multifunctional Size 1.5x2.4m

Siemens placement machine SIPLACE SX2 Provide high-quality after-sales service High grade mounter:

Product features of Siemens SMT machine SIPLACE SX2 :

SIPLACESX series: the preferred placement solution for small batch and multi-variety SMT production

The SIPLACESX series focuses on scalability and flexibility. Customers can quickly import new products, quickly change settings without stopping the line,

Can produce products of any batch size, improving availability and efficiency.

Whether it is used in automotive, automation, medical, telecommunications or IT infrastructure-the SIPLACESX series can meet quality,

All requirements such as process reliability and speed.

Want to expand the SMT production line as needed ?

SIPLACESX is the first placement solution that can be fully expanded as needed with its unique interchangeable cantilever. Increase capacity when needed,

Reduce production capacity when the order volume decreases. We call it SIPLACE on-demand expansion.

Equipment characteristics:

Specifications:

Siemens placement machine SIPLACE SX2 machine parameters:

Supply Advantage:
Supply new and used siemens spare parts for smt machine.

• SIEMENS VALVE PLUNGER SP12 00351498-03
• SIEMENS 80S15 X MOTOR BB58.82.11-SN3-S
• SIEMENS 00119032
• SIEMENS CAMERA 00315224-06
• SIEMENS RV6 CAMERA 00346264
• SIEMENS NOZZLE 418 00322544-03
• SIEMENS NOZZLE 901 00322603-04
• SIEMENS NOZZLE 904 00322602-05
• SIEMENS NOZZLE 913 00345020-03
• SIEMENS NOZZLE 915 00321862-07
• SIEMENS NOZZLE 917 00321863-05
• SIEMENS NOZZLE 918 00321864-07
• SIEMENS NOZZLE 921 00325970-04
•  

SMT Advantage:

Surface mount technology, SMT and its associated surface mount devices, SMDs considerably speed up PCB assembly as the 

components simply mount on the board. 

Look inside any piece of commercially made electronic equipment these days and it is filled with minute devices. Rather 

than using traditional components with wire leads like those that may be used for home construction and kits, these 

components are mounted onto the surface of the boards and many are minute in size. 

1. Good mechanical performance under shock and vibration conditions. (Partly due to lower mass, and partly due to less 

cantilevering.)

2. Lower resistance and inductance at the connection; consequently, fewer unwanted RF signal effects and better and more 

predictable high-frequency performance.

3. Better EMC performance (lower radiated emissions) due to the smaller radiation loop area (because of the smaller 

package) and the lesser lead inductance.